Deal date
KANDO id: 702894
Financial Transaction:
Seed
Bump Technologies Inc
Round participants
| Investor | Country | Notes | |
|---|---|---|---|
|
Y CombinatorAmerican technology startup accelerator. |
United States | Initial investment. |
| Investor | Country | Notes | |
|---|---|---|---|
|
|
Y CombinatorAmerican technology startup accelerator. |
United States | Initial investment. |
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